CuNi30Mn1Fe | CW354H Material Datasheet

Material Test Series Values

Material Standard Values

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Material Description

Material Number	Material Number (single)	Standard	Range of Application	Standard Status	Country	Remark	Application temperature [°C]
CW354H (DIN EN 1652 : 1998-03)	CW354H	DIN EN 1652 : 1998-03	Supersedes DIN 17670-1 : 1983-12, DIN 17670-2 : 1969-06, DIN 1751 : 1973-06, DIN 1791 : 1973-06	Valid	Germany	CuNi30Mn1Fe (CW354H) is comparable to CuNi30Mn1Fe, mat. no. 2.0882, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. Fe-addition increases the corrosion resistance. CuNi30Mn1Fe is resistant to water and seawater, coolant and solvent, alkaline substances, alkaline saline solutions and non-oxidizing acids. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: good Application: For seawater pipilines, tubes and plates for all types of tubular heat-exchanger (condenser, cooler, seawater evaporators, high pressure feeder water heater) on ships, in power plants, in petroleum processing an in chemical factories as well as in saltern plants. The material is established for condenser in ammoniac steam.	-269 - 350

Chemical Composition

C [%]	Co [%]	Fe [%]	Mn [%]	Ni [%]	P [%]	Pb [%]	S [%]	Sn [%]	Zn [%]	Source	Remark
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Mechanical Properties

Semi-finished Product	Strength Abbrevation	Nominal Size [mm]	Temperature [°C]	Specimen Direction	Tensile Strength [MPa]	Yield Strength (0.2% offset) [MPa]	Yield Strength (1.0% offset) [MPa]	Elongation A [%]	Hardness HV	Source	Remark
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Physical Properties

Temperature [°C]	Melting Temperature [°C]	Density [g/cm³]	Young's Modulus [GPa]	Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1]	Thermal Conductivity [W/(m*K)]	Source	Remark
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Young's Modulus [GPa] vs Temperature [°C]

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Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]