Cu-ETP | CW004A Material Datasheet
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Material Number | Material Number (single) | Standard | Range of Application | Standard Status | Country | Remark |
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CW004A (DIN EN 1652 : 1998-03) | CW004A | DIN EN 1652 : 1998-03 | Supersedes DIN 17670-1 : 1983-12, DIN 17670-2 : 1969-06, DIN 1751 : 1973-06, DIN 1791 : 1973-06 | Valid | Germany | Cu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. To the comparable DIN-mark E-Cu58, mat. No 2.0065 acc. to DIN 1787 : 1973-01 applies: The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5) |
Chemical Composition
Bi [%] | Cu [%] | O [%] | Pb [%] | Source | Remark |
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Mechanical Properties
Semi-finished Product | Condition | Strength Abbrevation | Nominal Size [mm] | Temperature [°C] | Tensile Strength [MPa] | Yield Strength (0.2% offset) [MPa] | Elongation A [%] | Elongation A50 [%] | Reduction of Area [%] | Hardness HV | Source | Remark |
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Physical Properties
Condition | Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Poisson's Ratio | Mean Coefficient of Thermal Expansion [10^-6*K^-1] | Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] | Thermal Conductivity [W/(m*K)] | Specific Electrical Resistance [µΩm] | Mean Specific Heat Capacity [kJ/(kg*K)] | Electric Conductivity [MS/m] | Specific Electric Conductivity [% IACS] | Source | Remark |
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Young's Modulus [GPa] vs Temperature [°C]
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Unlock NowMean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]
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Unlock NowCreep Rupture Behaviour
Condition | Temperature [°C] | Creep Tensile Strength at 10² h [MPa] | Creep Tensile Strength at 10³ h [MPa] | Creep Tensile Strength at 10^4 h [MPa] | Source | Remark |
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Heat Treatment
Heat Treatment | Temperature [°C] | Source | Remark |
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Cross Reference
Material Name | Country | Standard | Source |
---|---|---|---|
Cu-ETP | Europe | EN 1652 | |
Cu-ETP | Europe | EN 12420 | |
Cu-ETP | Europe | EN 13599 | |
Cu-ETP | Europe | EN 13600 | |
Cu-ETP | Europe | EN 13601 | |
Cu-ETP | Europe | EN 13602 | |
Cu-ETP | Europe | EN 13605 | |
Cu-ETP | Europe | EN 1977 | |
Cu-ETP | International | ISO 431-81 | |
C11000 | USA | UNS | |
C11000 | USA | AMS 4500 | |
BCu-1b | USA | ASME SFA5.8 | |
B1 UNS C11000 | USA | ASTM B1 | |
B101 UNS C11000 | USA | ASTM B101 | |
B116 UNS C11000 | USA | ASTM B116 | |
B124 UNS C11000 | USA | ASTM B124 | |
B152 UNS C11000 | USA | ASTM B152 | |
B172 UNS C11000 | USA | ASTM B172 | |
B173 UNS C11000 | USA | ASTM B173 | |
B174 UNS C11000 | USA | ASTM B174 | |
B187 UNS C11000 | USA | ASTM B187 | |
B188 UNS C11000 | USA | ASTM B188 | |
B189 UNS C11000 | USA | ASTM B189 | |
B2 UNS C11000 | USA | ASTM B2 | |
B224 Type ETP | USA | ASTM B224 | |
B226 UNS C11000 | USA | ASTM B226 | |
B228 UNS C11000 | USA | ASTM B228 | |
B229 UNS C11000 | USA | ASTM B229 | |
B246 UNS C11000 | USA | ASTM B246 | |
B272 UNS C11000 | USA | ASTM B272 | |
B283 UNS C11000 | USA | ASTM B283 | |
B286 UNS C11000 | USA | ASTM B286 | |
B298 UNS C11000 | USA | ASTM B298 | |
B33 UNS C11000 | USA | ASTM B33 | |
B335 UNS C11000 | USA | ASTM B335 | |
B370 UNS C11000 | USA | ASTM B370 | |
B447 UNS C11000 | USA | ASTM B447 | |
B47 UNS C11000 | USA | ASTM B47 | |
B470 UNS C11000 | USA | ASTM B470 | |
B48 UNS C11000 | USA | ASTM B48 | |
B49 UNS C11000 | USA | ASTM B49 | |
B496 UNS C11000 | USA | ASTM B496 | |
B5 UNS C11000 | USA | ASTM B5 | |
B566 UNS C11000 | USA | ASTM B566 | |
B638 UNS C11000 | USA | ASTM B638 | |
B694 UNS C11000 | USA | ASTM B694 | |
B738 UNS C11000 | USA | ASTM B738 | |
B8 UNS C11000 | USA | ASTM B8 | |
F467 Alloy 110 | USA | ASTM F467 | |
F468 Alloy 110 | USA | ASTM F468 | |
BCu-1b | USA | AWS A5.8 | |
C11000 | USA | SAE J461 | |
C11000 | USA | SAE J463 | |
E-Cu58 | Germany | DIN 1787 | DIN CEN/TS 13388 (DIN SPEC 9700) |
2.0065 | Germany | DIN 1787 | DIN CEN/TS 13388 (DIN SPEC 9700) |
Producer/Supplier/Trade names
Tradename | Supplier |
---|---|
211 | William Prym Holding GmbH, Stolberg |
3010 | VDM Metals GmbH, Frankfurt/Main |
E-Cu | F. Hackländer GmbH, Kassel |
E-Cu | Heraeus Deutschland GmbH & Co. KG, Hanau |
E-Cu58 | CSN Carl Schreiber GmbH, Neunkirchen |
E-Cu58 | Wieland-Werke AG, Velbert |
E-Cu58 | KME Germany AG & Co.KG, Osnabrück |
E-Cu58 | Deutsche Giessdraht GmbH, Emmerich |
E-Cu58 | Wieland Prometa GmbH, Düsseldorf |
E-Cu58 | LEONI Draht GmbH, Weißenburg |
E-Kupfer | VDM Metals GmbH, Frankfurt/Main |
Material Compliance
REACh | RoHS |
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Cu-ETP (CW004A; DIN EN 1652 : 1998-03)
Linear-elastic
Temperature [°C] | Young's modulus [GPa] | Poisson's ratio |
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Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
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Coefficient thermal expansion
Related Temperature [°C] | Temperature [°C] | Coefficient thermal expansion [10^-6*K^-1] |
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Specific heat
Temperature [°C] | Specific heat [kJ/(kg*K)] |
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Density
Temperature [°C] | Density [g/cm³] |
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Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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Thermal conductivity
Temperature [°C] | Thermal conductivity [W/(m*K)] |
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Classification
WIAM Material | Source description |
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Designation
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Cu-ETP (soft annealed (+A); 4mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
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Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
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Cu-ETP (soft annealed (+A); 6.35mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
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blur | blur | blur | blur | blur | blur | blur | blur |
Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
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Cu-ETP (soft annealed (+A))
Linear-elastic
Temperature [°C] | Young's modulus [GPa] |
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Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
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Classification
Treatment | Source description |
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Cu-ETP (cold formed)
Linear-elastic
Temperature [°C] | Young's modulus [GPa] |
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Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
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blur | blur |
Classification
Treatment | Source description |
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blur | blur |
Cu-ETP (R200; bar; 5.000-0.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-ETP (R220; slat; 0.200-5.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-ETP (R240; bar; 0.200-15.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-ETP (R290; bar; 0.200-15.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-ETP (R360; slat; 0.200-2.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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Cu-ETP (extruded)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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Classification
Treatment | Source description |
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blur | blur |