Cu-ETP | CW004A Material Datasheet - Properties - Materials Portal

Cu-ETP | CW004A Material Datasheet

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Material Description

Material NumberMaterial Number (single)StandardRange of ApplicationStandard StatusCountryRemark
CW004A (DIN EN 1652 : 1998-03) CW004A DIN EN 1652 : 1998-03Supersedes DIN 17670-1 : 1983-12, DIN 17670-2 : 1969-06, DIN 1751 : 1973-06, DIN 1791 : 1973-06ValidGermanyCu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. To the comparable DIN-mark E-Cu58, mat. No 2.0065 acc. to DIN 1787 : 1973-01 applies: The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Chemical Composition

Bi [%]Cu [%]O [%]Pb [%]SourceRemark
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Mechanical Properties

Semi-finished ProductConditionStrength AbbrevationNominal Size [mm]Temperature [°C]Tensile Strength [MPa]Yield Strength (0.2% offset) [MPa]Elongation A [%]Elongation A50 [%]Reduction of Area [%]Hardness HVSourceRemark
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Physical Properties

ConditionTemperature [°C]Melting Temperature [°C]Density [g/cm³]Young's Modulus [GPa]Poisson's RatioMean Coefficient of Thermal Expansion [10^-6*K^-1]Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1]Thermal Conductivity [W/(m*K)]Specific Electrical Resistance [µΩm]Mean Specific Heat Capacity [kJ/(kg*K)]Electric Conductivity [MS/m]Specific Electric Conductivity [% IACS]SourceRemark
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Young's Modulus [GPa] vs Temperature [°C]

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Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]

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Creep Rupture Behaviour

ConditionTemperature [°C]Creep Tensile Strength at 10² h [MPa]Creep Tensile Strength at 10³ h [MPa]Creep Tensile Strength at 10^4 h [MPa]SourceRemark
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Heat Treatment

Heat TreatmentTemperature [°C]SourceRemark
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Cross Reference

Material NameCountryStandardSource
Cu-ETPEuropeEN 1652 
Cu-ETPEuropeEN 12420  
Cu-ETPEuropeEN 13599  
Cu-ETPEuropeEN 13600  
Cu-ETPEuropeEN 13601  
Cu-ETPEuropeEN 13602 
Cu-ETPEuropeEN 13605  
Cu-ETPEuropeEN 1977  
Cu-ETPInternationalISO 431-81 
C11000USAUNS 
C11000USAAMS 4500 
BCu-1bUSAASME SFA5.8 
B1 UNS C11000USAASTM B1 
B101 UNS C11000USAASTM B101 
B116 UNS C11000USAASTM B116 
B124 UNS C11000USAASTM B124 
B152 UNS C11000USAASTM B152 
B172 UNS C11000USAASTM B172 
B173 UNS C11000USAASTM B173 
B174 UNS C11000USAASTM B174 
B187 UNS C11000USAASTM B187 
B188 UNS C11000USAASTM B188 
B189 UNS C11000USAASTM B189 
B2 UNS C11000USAASTM B2 
B224 Type ETPUSAASTM B224 
B226 UNS C11000USAASTM B226 
B228 UNS C11000USAASTM B228 
B229 UNS C11000USAASTM B229 
B246 UNS C11000USAASTM B246 
B272 UNS C11000USAASTM B272 
B283 UNS C11000USAASTM B283 
B286 UNS C11000USAASTM B286 
B298 UNS C11000USAASTM B298 
B33 UNS C11000USAASTM B33 
B335 UNS C11000USAASTM B335 
B370 UNS C11000USAASTM B370 
B447 UNS C11000USAASTM B447 
B47 UNS C11000USAASTM B47 
B470 UNS C11000USAASTM B470 
B48 UNS C11000USAASTM B48 
B49 UNS C11000USAASTM B49 
B496 UNS C11000USAASTM B496 
B5 UNS C11000USAASTM B5 
B566 UNS C11000USAASTM B566 
B638 UNS C11000USAASTM B638 
B694 UNS C11000USAASTM B694 
B738 UNS C11000USAASTM B738 
B8 UNS C11000USAASTM B8 
F467 Alloy 110USAASTM F467 
F468 Alloy 110USAASTM F468 
BCu-1bUSAAWS A5.8 
C11000USASAE J461 
C11000USASAE J463 
E-Cu58GermanyDIN 1787DIN CEN/TS 13388 (DIN SPEC 9700)
2.0065GermanyDIN 1787DIN CEN/TS 13388 (DIN SPEC 9700)

Producer/Supplier/Trade names

TradenameSupplier
211William Prym Holding GmbH, Stolberg
3010VDM Metals GmbH, Frankfurt/Main
E-CuF. Hackländer GmbH, Kassel
E-CuHeraeus Deutschland GmbH & Co. KG, Hanau
E-Cu58CSN Carl Schreiber GmbH, Neunkirchen
E-Cu58Wieland-Werke AG, Velbert
E-Cu58KME Germany AG & Co.KG, Osnabrück
E-Cu58Deutsche Giessdraht GmbH, Emmerich
E-Cu58Wieland Prometa GmbH, Düsseldorf
E-Cu58LEONI Draht GmbH, Weißenburg
E-KupferVDM Metals GmbH, Frankfurt/Main

Material Compliance

REAChRoHS
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Cu-ETP (CW004A; DIN EN 1652 : 1998-03)

Linear-elastic

Temperature [°C]Young's modulus [GPa]Poisson's ratio
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Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Electrical resistivity

Temperature [°C]Specific electrical resistance [µΩm]
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Coefficient thermal expansion

Related Temperature [°C]Temperature [°C]Coefficient thermal expansion [10^-6*K^-1]
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Specific heat

Temperature [°C]Specific heat [kJ/(kg*K)]
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Density

Temperature [°C]Density [g/cm³]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Thermal conductivity

Temperature [°C]Thermal conductivity [W/(m*K)]
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Classification

WIAM MaterialSource description
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Designation

DesignationMaterial numberSource
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Cu-ETP (soft annealed (+A); 4mm; not specified)

Strain life

Temperature [°C]Cyclic fatigue strength coefficient [MPa]Cyclic fatigue strength exponentDuctility coefficient [Pa]Ductility exponentCyclic strength coefficient [MPa]Cyclic strain hardening exponentYoung's modulus [GPa]
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Classification

TreatmentDimension [mm]Failure criteriaSource description
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Cu-ETP (soft annealed (+A); 6.35mm; not specified)

Strain life

Temperature [°C]Cyclic fatigue strength coefficient [MPa]Cyclic fatigue strength exponentDuctility coefficient [Pa]Ductility exponentCyclic strength coefficient [MPa]Cyclic strain hardening exponentYoung's modulus [GPa]
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Classification

TreatmentDimension [mm]Failure criteriaSource description
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Cu-ETP (soft annealed (+A))

Linear-elastic

Temperature [°C]Young's modulus [GPa]
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Electrical resistivity

Temperature [°C]Specific electrical resistance [µΩm]
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Classification

TreatmentSource description
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Cu-ETP (cold formed)

Linear-elastic

Temperature [°C]Young's modulus [GPa]
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Electrical resistivity

Temperature [°C]Specific electrical resistance [µΩm]
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Classification

TreatmentSource description
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Cu-ETP (R200; bar; 5.000-0.000mm)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSemi-finished productDimension [mm]Source description
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Cu-ETP (R220; slat; 0.200-5.000mm)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSemi-finished productDimension [mm]Source description
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Cu-ETP (R240; bar; 0.200-15.000mm)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSemi-finished productDimension [mm]Source description
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Cu-ETP (R290; bar; 0.200-15.000mm)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSemi-finished productDimension [mm]Source description
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Cu-ETP (R360; slat; 0.200-2.000mm)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSemi-finished productDimension [mm]Source description
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Cu-ETP (extruded)

Yield strength

Temperature [°C]0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]Tensile strength [MPa]
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Classification

TreatmentSource description
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